JPH0412618B2 - - Google Patents

Info

Publication number
JPH0412618B2
JPH0412618B2 JP3716383A JP3716383A JPH0412618B2 JP H0412618 B2 JPH0412618 B2 JP H0412618B2 JP 3716383 A JP3716383 A JP 3716383A JP 3716383 A JP3716383 A JP 3716383A JP H0412618 B2 JPH0412618 B2 JP H0412618B2
Authority
JP
Japan
Prior art keywords
lead frame
positioning
guide rail
bonding
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3716383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59161809A (ja
Inventor
Takeo Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58037163A priority Critical patent/JPS59161809A/ja
Priority to US06/586,696 priority patent/US4624358A/en
Priority to DE3408368A priority patent/DE3408368C2/de
Publication of JPS59161809A publication Critical patent/JPS59161809A/ja
Publication of JPH0412618B2 publication Critical patent/JPH0412618B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Conveyors (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Wire Bonding (AREA)
JP58037163A 1983-03-07 1983-03-07 リ−ドフレ−ム搬送装置 Granted JPS59161809A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58037163A JPS59161809A (ja) 1983-03-07 1983-03-07 リ−ドフレ−ム搬送装置
US06/586,696 US4624358A (en) 1983-03-07 1984-03-06 Device for transferring lead frame
DE3408368A DE3408368C2 (de) 1983-03-07 1984-03-07 Fördervorrichtung für geführte Rahmen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58037163A JPS59161809A (ja) 1983-03-07 1983-03-07 リ−ドフレ−ム搬送装置

Publications (2)

Publication Number Publication Date
JPS59161809A JPS59161809A (ja) 1984-09-12
JPH0412618B2 true JPH0412618B2 (en]) 1992-03-05

Family

ID=12489925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58037163A Granted JPS59161809A (ja) 1983-03-07 1983-03-07 リ−ドフレ−ム搬送装置

Country Status (1)

Country Link
JP (1) JPS59161809A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5026863B2 (ja) * 2007-05-31 2012-09-19 株式会社日立ハイテクインスツルメンツ 半導体素子の装着装置
JP5042145B2 (ja) * 2008-06-27 2012-10-03 芝浦メカトロニクス株式会社 電子部品の実装装置

Also Published As

Publication number Publication date
JPS59161809A (ja) 1984-09-12

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